Inventor

LIN BO-JIUN

TW21 patents

⚠️ This page may combine multiple inventors who share the name “LIN BO-JIUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN BO-JIUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device having a porous low-k structure

Porogen bonded gap filling material in semiconductor manufacturing

Integrated circuit interconnects and methods of making same

System and method for dark field inspection

System and method of forming a porous low-k structure

Interconnect structure of semiconductor device and method of forming same

Interconnect structure and semiconductor device having the same

Porogen bonded gap filling material in semiconductor manufacturing

Semiconductor device, memory cell and method of forming the same

Porogen bonded gap filling material in semiconductor manufacturing

System and method of forming a porous low-k structure

Method of forming interconnect structure

Interconnect structure and method

Semiconductor structure and manufacturing methods thereof

Interconnect structure and method

Porogen bonded gap filling material in semiconductor manufacturing

System and method of forming a porous low-K structure

High boiling temperature solvent additives for semiconductor processing

TAIWAN SEMICONDUCTOR MFG

System and method for dark field inspection

LO CHING-YU

Interconnect with flexible dielectric layer

LIN BO-JIUN

High mechanical strength additives for porous ultra low-k material