Inventor

LEE BYOUNG-OK

KR11 patents

⚠️ This page may combine multiple inventors who share the name “LEE BYOUNG-OK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FAIRCHILD KR SEMICONDUCTOR LTD

2 patents

US7061080B2Jun 13, 2006

Power module package having improved heat dissipating capability

FAIRCHILD KR SEMICONDUCTOR LTD127 citations98

US7208819B2Apr 24, 2007

Power module package having improved heat dissipating capability

FAIRCHILD KR SEMICONDUCTOR LTD69 citations97

JEON OSEOB

2 patents

US8183088B2May 22, 2012

Semiconductor die package and method for making the same

JEON OSEOB22 citations90

US8664752B2Mar 4, 2014

Semiconductor die package and method for making the same

JEON OSEOB9 citations80

SON JOON-SEO

2 patents

US8067826B2Nov 29, 2011

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

SON JOON-SEO5 citations68

US8945992B2Feb 3, 2015

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

SON JOON-SEO0 citations47

LG ELECTRONICS INC

1 patent

US6445418B1Sep 3, 2002

Video coding and decoding method

LG ELECTRONICS INC17 citations80

IM SEUNGWON

1 patent

US8552541B2Oct 8, 2013

Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

IM SEUNGWON15 citations77

BAEK DONG-HYUN

1 patent

US9141905B2Sep 22, 2015

Card-type information recording medium having embedded antenna for near field communication and manufacturing method thereof

BAEK DONG-HYUN2 citations55

MTEK VISION CO LTD

1 patent

US9070071B2Jun 30, 2015

Card-type information recording medium having embedded antenna for near field communication and manufacturing method thereof

MTEK VISION CO LTD1 citations50

FAIRCHILD SEMICONDUCTOR

1 patent

US9159656B2Oct 13, 2015

Semiconductor die package and method for making the same

FAIRCHILD SEMICONDUCTOR0 citations49