Inventor

JANG DONG-HYEON

KR45 patents

⚠️ This page may combine multiple inventors who share the name “JANG DONG-HYEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JANG DONG-HYEON

SAMSUNG ELECTRONICS CO LTD

Chip stack package and manufacturing method thereof

Chip scale packages and methods for manufacturing the chip scale packages at wafer level

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Chip stack package and manufacturing method thereof

Wafer level stack chip package and method for manufacturing same

method for manufacturing a semiconductor package

Wafer level package and method for manufacturing the same

Wafer level package and method for manufacturing the same

Semiconductor package

Wafer level package and method for manufacturing the same

Chipstack package and manufacturing method thereof

Method for manufacturing a wafer level chip scale package

Image sensor device and method of manufacturing same

Semiconductor packages

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

3D semiconductor device

Chipstack package and manufacturing method thereof

Wafer level package having redistribution interconnection layer and method of forming the same

Wafer-level electronic modules with integral connector contacts

Semiconductor package including redistribution pattern and method of manufacturing the same

Center pad type IC chip with jumpers, method of processing the same and multi chip package

Wafer level chip scale package having a gap and method for manufacturing the same

Chip scale packages manufactured at wafer level

Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same

Board on chip package and method of manufacturing the same

Method for forming solder bump structure

Method of forming metal lines and bumps for semiconductor devices

Wafer level chip scale package having a gap and method for manufacturing the same

Semiconductor packages

Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

Method of manufacturing chip-stacked semiconductor package

Image sensor device and method of manufacturing the same

Board on chip package and method of manufacturing the same

SAMSUNG DISPLAY CO LTD

Display device

Display device including dummy lines overlapping connection lines

Display device

LEE TEAK-HOON

Method of fabricating stacked chips in a semiconductor package

Stacked chips in a semiconductor package

CHUNG HYUN-SOO

Semiconductor packages and methods of manufacturing the same

Wafer level semiconductor module and method for manufacturing the same

KANG UK-SONG

3D semiconductor device

LEE HO-JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

LEE HO JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

AHN JUNG-SEOK

Method of manufacturing chip-stacked semiconductor package

HWANG SON-KWAN

Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same