Inventor
SONG HO-GEON
KR25 patents
⚠️ This page may combine multiple inventors who share the name “SONG HO-GEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS9343361B2May 17, 2016
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations84
US9099460B2Aug 4, 2015
Stack semiconductor package and manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US8890294B2Nov 18, 2014
Stack semiconductor package and manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations73
US11495576B2Nov 8, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10756062B2Aug 25, 2020
Semiconductor chip and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US7576438B2Aug 18, 2009
Printed circuit board and method thereof and a solder ball land and method thereof
SAMSUNG ELECTRONICS CO LTD5 citations72
US9136260B2Sep 15, 2015
Method of manufacturing chip-stacked semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations61
US10896879B2Jan 19, 2021
Semiconductor package having reflective layer with selective transmittance
SAMSUNG ELECTRONICS CO LTD0 citations60
US8053351B2Nov 8, 2011
Method of forming at least one bonding structure
SAMSUNG ELECTRONICS CO LTD2 citations58
US9184065B2Nov 10, 2015
Method of molding semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US8956921B2Feb 17, 2015
Method of molding semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US8927340B2Jan 6, 2015
Double-sided adhesive tape, semiconductor packages, and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US8039972B2Oct 18, 2011
Printed circuit board and method thereof and a solder ball land and method thereof
SAMSUNG ELECTRONICS CO LTD1 citations51