P

Inventor

YOON MIN-SEUNG

KR10 patents
⚠️ This page may combine multiple inventors who share the name “YOON MIN-SEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

4 patents
US9343361B2May 17, 2016

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

SAMSUNG ELECTRONICS CO LTD11 citations84
US8373261B2Feb 12, 2013

Chip stack package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD9 citations83
US11081440B2Aug 3, 2021

Interposer and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD7 citations82
US11705391B2Jul 18, 2023

Interposer and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations61

LEE HO-JIN

2 patents
US8592991B2Nov 26, 2013

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

LEE HO-JIN31 citations92
US8415804B2Apr 9, 2013

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

LEE HO-JIN7 citations83

LEE HO JIN

1 patent
US9941196B2Apr 10, 2018

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

LEE HO JIN5 citations84

MA KEUM-HEE

1 patent
US8513802B2Aug 20, 2013

Multi-chip package having semiconductor chips of different thicknesses from each other and related device

MA KEUM-HEE14 citations79

LEE KYU-HA

1 patent
US8114772B2Feb 14, 2012

Method of manufacturing the semiconductor device

LEE KYU-HA6 citations64

HWANG SON-KWAN

1 patent
US8183673B2May 22, 2012

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

HWANG SON-KWAN5 citations58