Inventor
WEE TIN TIN
US16 patents
⚠️ This page may combine multiple inventors who share the name “WEE TIN TIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
12 patentsUS9977078B2May 22, 2018
Systems and methods for wafer-level loopback test
QUALCOMM INC8 citations82
US9245870B1Jan 26, 2016
Systems and methods for providing data channels at a die-to-die interface
QUALCOMM INC7 citations81
US9767889B1Sep 19, 2017
Programmable pad capacitance for supporting bidirectional signaling from unterminated endpoints
QUALCOMM INC7 citations78
US9244875B1Jan 26, 2016
Systems and methods for transition-minimized data bus inversion
QUALCOMM INC3 citations72
US10114074B2Oct 30, 2018
Systems and methods for wafer-level loopback test
QUALCOMM INC2 citations71
US9350339B2May 24, 2016
Systems and methods for clock distribution in a die-to-die interface
QUALCOMM INC3 citations71
US9614703B2Apr 4, 2017
Circuits and methods providing high-speed data link with equalizer
QUALCOMM INC6 citations70
US10410965B2Sep 10, 2019
Layout technique for middle-end-of-line
QUALCOMM INC5 citations64
US10044342B2Aug 7, 2018
Delay line for one shot pre-emphasis
QUALCOMM INC0 citations51
US9984011B2May 29, 2018
Termination schemes for multi-rank memory bus architectures
QUALCOMM INC0 citations51
US9654090B2May 16, 2017
Systems and methods for clock distribution in a die-to-die interface
QUALCOMM INC0 citations50
US10325845B2Jun 18, 2019
Layout technique for middle-end-of-line
QUALCOMM INC0 citations43