Inventor
CHEN NAN-JANG
TW34 patents
⚠️ This page may combine multiple inventors who share the name “CHEN NAN-JANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
21 patentsUS8018037B2Sep 13, 2011
Semiconductor chip package
MEDIATEK INC15 citations84
US7834436B2Nov 16, 2010
Semiconductor chip package
MEDIATEK INC8 citations84
US7834435B2Nov 16, 2010
Leadframe with extended pad segments between leads and die pad, and leadframe package using the same
MEDIATEK INC7 citations74
US10019048B2Jul 10, 2018
Early power compensation method and apparatus thereof
MEDIATEK INC3 citations73
US9955581B2Apr 24, 2018
SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
MEDIATEK INC2 citations71
US9269653B2Feb 23, 2016
SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
MEDIATEK INC4 citations71
US8350380B2Jan 8, 2013
Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
MEDIATEK INC2 citations63
US7932586B2Apr 26, 2011
Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof
MEDIATEK INC6 citations63
US7875965B2Jan 25, 2011
Semiconductor chip package
MEDIATEK INC2 citations63
US11903121B2Feb 13, 2024
Printed circuit board design for high speed application
MEDIATEK INC0 citations62
US10772191B2Sep 8, 2020
Printed circuit board design for high speed application
MEDIATEK INC0 citations52
US10485095B2Nov 19, 2019
Printed circuit board design for high speed application
MEDIATEK INC0 citations52
US10211134B2Feb 19, 2019
Semiconductor package
MEDIATEK INC0 citations52
US10163767B2Dec 25, 2018
Semiconductor package
MEDIATEK INC0 citations52
US9852966B2Dec 26, 2017
Semiconductor package
MEDIATEK INC0 citations52
US9806053B2Oct 31, 2017
Semiconductor package
MEDIATEK INC0 citations52
US9406595B2Aug 2, 2016
Semiconductor package
MEDIATEK INC0 citations52
US9392696B2Jul 12, 2016
Semiconductor package
MEDIATEK INC0 citations52
US9147664B2Sep 29, 2015
Semiconductor package
MEDIATEK INC0 citations52
US8941221B2Jan 27, 2015
Semiconductor package
MEDIATEK INC0 citations52
US10426035B2Sep 24, 2019
SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
MEDIATEK INC0 citations39
CHEN NAN-JANG
10 patentsUS8120927B2Feb 21, 2012
Printed circuit board
CHEN NAN-JANG6 citations83
US8058720B2Nov 15, 2011
Semiconductor package
CHEN NAN-JANG14 citations81
US8213206B2Jul 3, 2012
Electronic apparatus
CHEN NAN-JANG6 citations72
US8212343B2Jul 3, 2012
Semiconductor chip package
CHEN NAN-JANG3 citations62
US8525310B2Sep 3, 2013
Leadframe package for high-speed data rate applications
CHEN NAN-JANG2 citations61
US9681554B2Jun 13, 2017
Printed circuit board
CHEN NAN-JANG0 citations51
US9445492B2Sep 13, 2016
Printed circuit board
CHEN NAN-JANG1 citations51
US8288848B2Oct 16, 2012
Semiconductor chip package including a lead frame
CHEN NAN-JANG0 citations51
US8124461B2Feb 28, 2012
Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
CHEN NAN-JANG1 citations51
US8106490B2Jan 31, 2012
Semiconductor chip package
CHEN NAN-JANG0 citations51