P

Inventor

CHEN WEI CHIH

TW167 patents
⚠️ This page may combine multiple inventors who share the name “CHEN WEI CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

20 patents
US11456280B2Sep 27, 2022

Semiconductor package and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10833053B1Nov 10, 2020

Semiconductor package and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US10510704B2Dec 17, 2019

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11404369B2Aug 2, 2022

Semiconductor device structure with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10304772B2May 28, 2019

Semiconductor device structure with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US12538808B2Jan 27, 2026

Die and package structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations75
US11550354B2Jan 10, 2023

Systems and methods for multi-phase clock generation

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12218009B2Feb 4, 2025

Semiconductor package and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations74
US11961777B2Apr 16, 2024

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11791313B2Oct 17, 2023

Semiconductor package and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11417582B2Aug 16, 2022

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11404342B2Aug 2, 2022

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11270927B2Mar 8, 2022

Package structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11201079B2Dec 14, 2021

Wafer chuck

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11164839B2Nov 2, 2021

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11164814B2Nov 2, 2021

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11031289B2Jun 8, 2021

Semiconductor package and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10873484B2Dec 22, 2020

Device with equaler circuit

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10515947B2Dec 24, 2019

Decoupling capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10332856B2Jun 25, 2019

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

(unassigned)

10 patents

CUNO INC

6 patents

CHEN WEI CHIH

3 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

CHEN WEI-CHIH

1 patent

PIXART IMAGING INC

1 patent

KINPO ELECT INC

1 patent

YOKE IND CORP

1 patent

WANG PING-FU

1 patent

TUSON (JIAXING) CORP

1 patent

YUNG TA HARDWARE & PLASTIC CO

1 patent

LITE ON ELECTRONICS GUANGZHOU

1 patent

AUDIOWISE TECH INC

1 patent

Showing the top 50 of 167 patents by PatentIndex Score.