Inventor

DESHPANDE NITIN

US31 patents

⚠️ This page may combine multiple inventors who share the name “DESHPANDE NITIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DESHPANDE NITIN

INTEL CORP

Low temperature phase change thermal interface material dam

Methods including fluxless chip attach processes

Patch on interposer architecture for low cost optical co-packaging

Methods for high precision microelectronic die integration

Electronic device with solder pads including projections

Electronic assembly that includes a bridge

Electronic package design that facilitates shipping the electronic package

Integrated circuit assembly that includes stacked dice

Coupled cooling fins in ultra-small systems

Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias

Faraday rotator interconnect as a through-via configuration in a patch architecture

Open cavity bridge co-planar placement architectures and processes

Silicon groove architectures and manufacturing processes for passive alignment in a photonics die

Open cavity bridge power delivery architectures and processes

Package on package thermal transfer systems and methods

Thermal management solutions for integrated circuit packages

Enabling passive alignment for lens attach

Package expanded beam connector for on-package optics

Flux spray atomization and splash control

Edge-aligned template structure for integrated packages including an integrated circuit device within an opening of the template structure

Formation of a reconstituted circuit device using flow of a material by capillary action

Edge-aligned template structure for integrated circuit packages

Package on package thermal transfer systems and methods

Electronic assembly that includes stacked electronic devices

Methods for high precision microelectronic die integration

Micro-lens array optically coupled with a photonics die

Integrated circuit assembly that includes stacked dice

High bandwidth optical interconnection architectures

Moisture seal coating of hybrid bonded stacked die package assembly

RAMANAN HARIKRISHNAN

Rotational-flow spray nozzle and process of using same

Rotational-flow spray nozzle and process of using same