Inventor
GOSSELIN TIMOTHY A
US12 patents
⚠️ This page may combine multiple inventors who share the name “GOSSELIN TIMOTHY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS10418329B2Sep 17, 2019
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
INTEL CORP11 citations83
US11676900B2Jun 13, 2023
Electronic assembly that includes a bridge
INTEL CORP2 citations72
US11075166B2Jul 27, 2021
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
INTEL CORP3 citations72
US10845552B2Nov 24, 2020
Coreless package architecture for multi-chip opto-electronics
INTEL CORP4 citations72
US12557675B2Feb 17, 2026
Inorganic redistribution layer on organic substrate in integrated circuit packages
INTEL CORP0 citations57
US10790231B2Sep 29, 2020
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
INTEL CORP0 citations51
IBM
5 patentsUS6805974B2Oct 19, 2004
Lead-free tin-silver-copper alloy solder composition
IBM59 citations94
US7740713B2Jun 22, 2010
Flux composition and techniques for use thereof
IBM17 citations83
US7101782B2Sep 5, 2006
Method of making a circuitized substrate
IBM10 citations72
US7037819B2May 2, 2006
Method of making a circuitized substrate
IBM3 citations61
US6818988B2Nov 16, 2004
Method of making a circuitized substrate and the resultant circuitized substrate
IBM3 citations61