Inventor
GEORGE RENE
US28 patents
⚠️ This page may combine multiple inventors who share the name “GEORGE RENE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS11658006B2May 23, 2023
Plasma sources and plasma processing apparatus thereof
APPLIED MATERIALS INC4 citations74
US11854770B2Dec 26, 2023
Plasma processing with independent temperature control
APPLIED MATERIALS INC2 citations73
US11959169B2Apr 16, 2024
Asymmetric injection for better wafer uniformity
APPLIED MATERIALS INC2 citations72
US11486038B2Nov 1, 2022
Asymmetric injection for better wafer uniformity
APPLIED MATERIALS INC3 citations72
US9831091B2Nov 28, 2017
Plasma treating a process chamber
APPLIED MATERIALS INC4 citations71
US12272521B2Apr 8, 2025
Plasma sources and plasma processing apparatus thereof
APPLIED MATERIALS INC0 citations62
US12272531B2Apr 8, 2025
Dual pressure oxidation method for forming an oxide layer in a feature
APPLIED MATERIALS INC0 citations62
US11529592B2Dec 20, 2022
Gas injector with baffle
APPLIED MATERIALS INC0 citations62
US11077410B2Aug 3, 2021
Gas injector with baffle
APPLIED MATERIALS INC1 citations62
US11885021B2Jan 30, 2024
Gas supply member with baffle
APPLIED MATERIALS INC0 citations61
US11124878B2Sep 21, 2021
Gas supply member with baffle
APPLIED MATERIALS INC0 citations61
US10971357B2Apr 6, 2021
Thin film treatment process
APPLIED MATERIALS INC0 citations61
US10290504B2May 14, 2019
Plasma treating a process chamber
APPLIED MATERIALS INC1 citations61
US12139790B2Nov 12, 2024
Processing system and method of delivering a reactant gas
APPLIED MATERIALS INC0 citations59
US12548740B2Feb 10, 2026
Apparatus to improve process non-uniformity for semiconductor direct plasma processing
APPLIED MATERIALS INC0 citations56
US12211677B2Jan 28, 2025
Uniformity control for plasma processing
APPLIED MATERIALS INC0 citations51
US10504779B2Dec 10, 2019
Hydrogenation and nitridization processes for reducing oxygen content in a film
APPLIED MATERIALS INC0 citations51
US10236207B2Mar 19, 2019
Hydrogenation and nitridization processes for reducing oxygen content in a film
APPLIED MATERIALS INC0 citations51
MATTSON TECH INC
7 patentsUS6335293B1Jan 1, 2002
Systems and methods for two-sided etch of a semiconductor substrate
MATTSON TECH INC384 citations95
US6379576B2Apr 30, 2002
Systems and methods for variable mode plasma enhanced processing of semiconductor wafers
MATTSON TECH INC47 citations93
US7232767B2Jun 19, 2007
Slotted electrostatic shield modification for improved etch and CVD process uniformity
MATTSON TECH INC25 citations92
US7276122B2Oct 2, 2007
Multi-workpiece processing chamber
MATTSON TECH INC25 citations90
US6624082B2Sep 23, 2003
Systems and methods for two-sided etch of a semiconductor substrate
MATTSON TECH INC23 citations89
US7799685B2Sep 21, 2010
System and method for removal of photoresist in transistor fabrication for integrated circuit manufacturing
MATTSON TECH INC16 citations82
US7947605B2May 24, 2011
Post ion implant photoresist strip using a pattern fill and method
MATTSON TECH INC1 citations52