Inventor
MIYAKAWA KUNIKO
JP10 patents
Patents
10 patentsUS5686760ANov 11, 1997
Eutectic Cu-alloy wiring structure in a semiconductor device
NEC CORP58 citations95
US5543357AAug 6, 1996
Process of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metal
NEC CORP27 citations92
US5278449AJan 11, 1994
Semiconductor memory device
NEC CORP23 citations91
US5169803ADec 8, 1992
Method of filling contact holes of a semiconductor device
NEC CORP45 citations91
US6114765ASep 5, 2000
C49-structured tungsten-containing titanium salicide structure and method of forming the same
NEC CORP9 citations73
US6069045AMay 30, 2000
Method of forming C49-structure tungsten-containing titanium salicide structure
NEC CORP5 citations73
US5880505AMar 9, 1999
C49-structured tungsten-containing titanium salicide structure
NEC CORP11 citations73
US5990005ANov 23, 1999
Method of burying a contact hole with a metal for forming multilevel interconnections
NEC CORP10 citations72
US5869397AFeb 9, 1999
Method of manufacturing semiconductor device
NEC CORP12 citations72
US5851915ADec 22, 1998
Method of manufacturing a semiconductor device through a reduced number of simple processes at a relatively low cost
NEC CORP16 citations72