Inventor
TAI ENYONG
SG5 patents
⚠️ This page may combine multiple inventors who share the name “TAI ENYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
3 patentsUS11309281B2Apr 19, 2022
Overlapping die stacks for NAND package architecture
MICRON TECHNOLOGY INC5 citations83
US12444709B2Oct 14, 2025
Overlapping die stacks for NAND package architecture
MICRON TECHNOLOGY INC0 citations61
US11908833B2Feb 20, 2024
Overlapping die stacks for nand package architecture
MICRON TECHNOLOGY INC0 citations61