Inventor

TAKIAR HEM P

US92 patents

⚠️ This page may combine multiple inventors who share the name “TAKIAR HEM P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKIAR HEM P

SANDISK CORP

Memory cards having two standard sets of contacts

Memory cards having two standard sets of contacts

Memory card with two standard sets of contacts and a contact covering mechanism

Memory card with contacts, device connector, and a connector covering mechanism

Memory card with push-push connector

Memory card with integral covered second device connector for use with computing devices without a memory card slot

Memory card

Memory card with two sets of contacts

Memory card

Memory card

Memory card with and without enclosure

Memory card with adapter

Memory card with raised portion

Memory card with chamfer

Memory card with a contact covering lid

Memory card

Combined memory card and carrier assembly

Combined memory card and carrier assembly

Method for efficiently producing removable peripheral cards

Memory card

Memory card

Memory card with two sets of contacts

Memory card with two sets of contacts

Memory card with two sets of contacts

Stackable integrated circuit package and method therefor

Memory card with two standard sets of contacts and a contact covering mechanism

Memory card with two standard sets of contacts and a hinged contact covering mechanism

NAT SEMICONDUCTOR CORP

Stacked multi-chip modules and method of manufacturing

Stacked multi-chip modules and method of manufacturing

Stacked multi-chip modules and method of manufacturing

Bonding pad interconnection structure

Chip scale package with compliant leads

Method and apparatus for forming a plastic chip on chip package module

Techniques for wafer level molding of underfill encapsulant

Lead frame including an inductor or other such magnetic component

Electronic assembly for connecting to an electronic system and method of manufacture thereof

Method of making removable computer peripheral cards having a solid one-piece housing

Leadframe for an integrated circuit package which electrically interconnects multiple integrated circuit die

Method and apparatus for forming an underfill adhesive layer

Method for forming a panel of packaged integrated circuits

Connection assembly for reflective liquid crystal projection with branched PCB display

Method of making integrated circuit packages

Fusible seal for LCD devices and methods for making same

Method of making flip chip and BGA interconnections

Multichip integrated circuit module with crossed bonding wires

Removable computer peripheral cards having a solid one-piece housing

Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module

Electronic assembly for connecting to an electronic system and method of manufacture thereof

Wafer level chip scale package

Metal coated markings on integrated circuit devices