Inventor
KOSTEVA STEPHEN JOHN
US4 patents
Patents
4 patentsUS5969947AOct 19, 1999
Integral design features for heatsink attach for electronic packages
IBM48 citations94
US6373703B2Apr 16, 2002
Integral design features for heatsink attach for electronic packages
IBM38 citations90
US5870285AFeb 9, 1999
Assembly mounting techniques for heat sinks in electronic packaging
IBM35 citations89
US5955782ASep 21, 1999
Apparatus and process for improved die adhesion to organic chip carriers
IBM13 citations69