Inventor
LEE RONG-SHEN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “LEE RONG-SHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
9 patentsUS5736785AApr 7, 1998
Semiconductor package for improving the capability of spreading heat
IND TECH RES INST192 citations98
US6590282B1Jul 8, 2003
Stacked semiconductor package formed on a substrate and method for fabrication
IND TECH RES INST145 citations97
US6459150B1Oct 1, 2002
Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer
IND TECH RES INST125 citations97
US5977626ANov 2, 1999
Thermally and electrically enhanced PBGA package
IND TECH RES INST426 citations96
US6479321B2Nov 12, 2002
One-step semiconductor stack packaging method
IND TECH RES INST38 citations92
US6536653B2Mar 25, 2003
One-step bumping/bonding method for forming semiconductor packages
IND TECH RES INST21 citations89
US6166435ADec 26, 2000
Flip-chip ball grid array package with a heat slug
IND TECH RES INST25 citations89
US9111774B2Aug 18, 2015
Wafer-to-wafer stack with supporting post
IND TECH RES INST3 citations62
US7948072B2May 24, 2011
Wafer-to-wafer stacking
IND TECH RES INST1 citations52