Inventor
TETREAULT REAL
CA8 patents
Patents
8 patentsUS6508595B1Jan 21, 2003
Assembly of opto-electronic module with improved heat sink
IBM58 citations94
US6822875B2Nov 23, 2004
Assembly of opto-electronic module with improved heat sink
IBM27 citations90
US6547452B1Apr 15, 2003
Alignment systems for subassemblies of overmolded optoelectronic modules
IBM22 citations89
US6309575B1Oct 30, 2001
Transfer molding method for forming integrated circuit package
IBM20 citations88
US5939778AAug 17, 1999
Integrated circuit chip package
IBM32 citations88
US6988882B2Jan 24, 2006
Transfer molding of integrated circuit packages
IBM7 citations70
US6956296B2Oct 18, 2005
Transfer molding of integrated circuit packages
IBM9 citations70
US6656773B2Dec 2, 2003
Transfer molding of integrated circuit packages
IBM9 citations70