Inventor
IKETAKI KENJI
JP6 patents
Patents
6 patentsUS5560534AOct 1, 1996
Soldering apparatus
FUJITSU LTD20 citations90
US6541898B2Apr 1, 2003
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method
FUJITSU LTD14 citations83
US6467141B2Oct 22, 2002
Method of assembling micro-actuator
FUJITSU LTD12 citations73
US6744183B2Jun 1, 2004
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method
FUJITSU LTD2 citations62
US7759613B2Jul 20, 2010
Reflowing apparatus and reflowing method
FUJITSU LTD2 citations59
US6787711B2Sep 7, 2004
Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device
FUJITSU LTD0 citations50