Inventor
YOSHIMOTO KAZUHIRO
JP26 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIMOTO KAZUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
8 patentsUS6824643B2Nov 30, 2004
Method and device of peeling semiconductor device using annular contact members
FUJITSU LTD85 citations98
US6750074B2Jun 15, 2004
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD13 citations92
US6837776B2Jan 4, 2005
Flat-object holder and method of using the same
FUJITSU LTD35 citations91
US7395847B2Jul 8, 2008
Jig for a semiconductor substrate
FUJITSU LTD9 citations84
US7109561B2Sep 19, 2006
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD4 citations73
US6902944B2Jun 7, 2005
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD5 citations73
US7432114B2Oct 7, 2008
Semiconductor device manufacturing method
FUJITSU LTD6 citations62
US6951800B2Oct 4, 2005
Method of making semiconductor device that has improved structural strength
FUJITSU LTD1 citations52
SHARP KK
5 patentsUS8345303B2Jan 1, 2013
Image processing apparatus
SHARP KK3 citations62
US11886762B2Jan 30, 2024
Printing control system
SHARP KK0 citations52
US11809754B2Nov 7, 2023
Printing control system
SHARP KK0 citations52
US11762615B2Sep 19, 2023
Printing system and control method of printing system
SHARP KK0 citations52
US12307145B2May 20, 2025
Output system for outputting content acquired from server device and terminal device for outputting reception slip to be used in output of content
SHARP KK0 citations47
FUJITSU SEMICONDUCTOR LTD
4 patentsUS7857140B2Dec 28, 2010
Semiconductor wafer storage case and semiconductor wafer storing method
FUJITSU SEMICONDUCTOR LTD20 citations92
US9010615B2Apr 21, 2015
Bonding apparatus and bonding method
FUJITSU SEMICONDUCTOR LTD3 citations62
US8016973B2Sep 13, 2011
Film bonding method, film bonding apparatus, and semiconductor device manufacturing method
FUJITSU SEMICONDUCTOR LTD2 citations62
US7820487B2Oct 26, 2010
Manufacturing method of semiconductor device
FUJITSU SEMICONDUCTOR LTD6 citations62
FUJITSU MICROELECTRONICS LTD
3 patentsUS7479627B2Jan 20, 2009
Semiconductor device having transparent member and manufacturing method of the same
FUJITSU MICROELECTRONICS LTD14 citations83
US7571538B2Aug 11, 2009
Vacuum fixing jig for semiconductor device
FUJITSU MICROELECTRONICS LTD3 citations62
US7655505B2Feb 2, 2010
Manufacturing method of semiconductor device
FUJITSU MICROELECTRONICS LTD0 citations41
MITSUBOSHI DIAMOND IND CO LTD
2 patentsUS7770500B2Aug 10, 2010
Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
MITSUBOSHI DIAMOND IND CO LTD9 citations79
US7426883B2Sep 23, 2008
Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
MITSUBOSHI DIAMOND IND CO LTD17 citations79