Inventor
TESHIROGI KAZUO
JP24 patents
⚠️ This page may combine multiple inventors who share the name “TESHIROGI KAZUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
13 patentsUS6824643B2Nov 30, 2004
Method and device of peeling semiconductor device using annular contact members
FUJITSU LTD85 citations98
US6388333B1May 14, 2002
Semiconductor device having protruding electrodes higher than a sealed portion
FUJITSU LTD285 citations97
US6750074B2Jun 15, 2004
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD13 citations92
US6528348B2Mar 4, 2003
Semiconductor device having protruding electrodes higher than a sealed portion
FUJITSU LTD36 citations92
US6461942B2Oct 8, 2002
Semiconductor chip removing and conveying method and device
FUJITSU LTD24 citations90
US7395847B2Jul 8, 2008
Jig for a semiconductor substrate
FUJITSU LTD9 citations84
US7109561B2Sep 19, 2006
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD4 citations73
US6902944B2Jun 7, 2005
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD5 citations73
US7485962B2Feb 3, 2009
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
FUJITSU LTD4 citations62
US7432114B2Oct 7, 2008
Semiconductor device manufacturing method
FUJITSU LTD6 citations62
US7704856B2Apr 27, 2010
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
FUJITSU LTD0 citations52
US7648907B2Jan 19, 2010
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
FUJITSU LTD0 citations52
US6951800B2Oct 4, 2005
Method of making semiconductor device that has improved structural strength
FUJITSU LTD1 citations52
FUJITSU SEMICONDUCTOR LTD
4 patentsUS7857140B2Dec 28, 2010
Semiconductor wafer storage case and semiconductor wafer storing method
FUJITSU SEMICONDUCTOR LTD20 citations92
US9010615B2Apr 21, 2015
Bonding apparatus and bonding method
FUJITSU SEMICONDUCTOR LTD3 citations62
US8016973B2Sep 13, 2011
Film bonding method, film bonding apparatus, and semiconductor device manufacturing method
FUJITSU SEMICONDUCTOR LTD2 citations62
US7820487B2Oct 26, 2010
Manufacturing method of semiconductor device
FUJITSU SEMICONDUCTOR LTD6 citations62
FUJITSU MICROELECTRONICS LTD
4 patentsUS7479627B2Jan 20, 2009
Semiconductor device having transparent member and manufacturing method of the same
FUJITSU MICROELECTRONICS LTD14 citations83
US7571538B2Aug 11, 2009
Vacuum fixing jig for semiconductor device
FUJITSU MICROELECTRONICS LTD3 citations62
US7563343B2Jul 21, 2009
Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus
FUJITSU MICROELECTRONICS LTD2 citations62
US7655505B2Feb 2, 2010
Manufacturing method of semiconductor device
FUJITSU MICROELECTRONICS LTD0 citations41