Inventor

VINCENT MICHAEL B

US87 patents

⚠️ This page may combine multiple inventors who share the name “VINCENT MICHAEL B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VINCENT MICHAEL B

NXP USA INC

Fan-out wafer level packages having preformed embedded ground plane connections

EMI/RFI shielding for semiconductor device packages

Microelectronic packages having embedded sidewall substrates and methods for the producing thereof

Semiconductor device with waveguide and method therefor

Semiconductor device packaging warpage control

Composite media protection for pressure sensor

Semiconductor device packaging warpage control

Topside heatsinking antenna launcher for an integrated circuit package

Package integrated waveguide

High aspect ratio connection for EMI shielding

Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements

Semiconductor device with open cavity and method therefor

Semiconductor device with low loss waveguide interface and method therefor

Semiconductor device with connector in package and method therefor

Plated opening with vent path

Semiconductor device with self-aligned waveguide and method therefor

Semiconductor device with self-aligned waveguide and method therefor

Semiconductor device package having stress isolation and method therefor

Semiconductor device packaging warpage control

Semiconductor device having a translation feature and method therefor

Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide

Semiconductor device with waveguide and method therefor

Semiconductor device having integrated antenna and method therefor

VINCENT MICHAEL B

Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof

Microelectronic packages having embedded sidewall substrates and methods for the producing thereof

Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof

Microelectronic packages having mold-embedded traces and methods for the production thereof

Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication

Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof

Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication

Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

Microelectronic packages having trench vias and methods for the manufacture thereof

FREESCALE SEMICONDUCTOR INC

Wafer level packaging method

Integrated electronic package and stacked assembly thereof

Packaged devices with multiple planes of embedded electronic devices

Electronic component package with multple electronic components

Microelectronic packages having mold-embedded traces and methods for the production thereof

IBM

Flip-chip package with underfill having low density filler

Flip-chip package with underfill having low density filler

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure

GONG ZHIWEI

EMI/RFI shielding for semiconductor device packages

Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof

NXP BV

Package

Semiconductor device and method

YAP WENG F

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

GONG ZHIWEI TONY

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

WRIGHT JASON R

Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication