Inventor

HAYES SCOTT M

US70 patents

⚠️ This page may combine multiple inventors who share the name “HAYES SCOTT M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAYES SCOTT M

NXP USA INC

Package integrated waveguide

EMI/RFI shielding for semiconductor device packages

Microelectronic packages having embedded sidewall substrates and methods for the producing thereof

Semiconductor device with waveguide and method therefor

Semiconductor device packaging warpage control

Semiconductor device packaging warpage control

Package integrated waveguide

Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements

Semiconductor device with open cavity and method therefor

Semiconductor device with connector in package and method therefor

Plated opening with vent path

Semiconductor device with self-aligned waveguide and method therefor

Semiconductor device with self-aligned waveguide and method therefor

Semiconductor device package having stress isolation and method therefor

Semiconductor device packaging warpage control

Semiconductor device having a translation feature and method therefor

Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide

High power semiconductor package subsystems

Semiconductor device with waveguide and method therefor

Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements

Semiconductor device package having thermal dissipation feature and method therefor

No-gel pressure sensor package

No-gel pressure sensor package

Semiconductor device with attached battery and method therefor

FREESCALE SEMICONDUCTOR INC

Radiation shielded module and method of shielding microelectronic device

Integrated conformal shielding method and process using redistributed chip packaging

Packaged devices with multiple planes of embedded electronic devices

Solder pad for semiconductor device package

Warp compensated electronic assemblies

Semiconductor device with a controlled cavity and method of formation

Method and apparatus for mini module EMI shielding evaluation

GONG ZHIWEI

Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits

EMI/RFI shielding for semiconductor device packages

Method of forming a packaged semiconductor device

Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof

Semiconductor device packaging having substrate with pre-encapsulation through via formation

Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits

VINCENT MICHAEL B

Microelectronic packages having embedded sidewall substrates and methods for the producing thereof

Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof

Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

Microelectronic packages having trench vias and methods for the manufacture thereof

XU JIANWEN

Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages

Method for releasing a microelectronic assembly from a carrier substrate

VISWANATHAN LAKSHMINARAYAN

High power semiconductor package subsystems

LYTLE WILLIAM H

Warp compensated package and method

HAYES SCOTT M

Method for packaging an electronic device assembly having a capped device interconnect

GONG ZHIWEI TONY

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

YAP WENG F

Optically-masked microelectronic packages and methods for the fabrication thereof

GAO WEI

Method for singulating electronic components from a substrate