Inventor

MOROIWA KOUDAI

JP2 patents

⚠️ This page may combine multiple inventors who share the name “MOROIWA KOUDAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUMCO CORP

1 patent

US12400909B2Aug 26, 2025

Method for producing support substrate for bonded wafer, and support substrate for bonded wafer

SUMCO CORP0 citations49

MARUOKA DAISUKE

1 patent

US8662961B2Mar 4, 2014

Polishing pad seasoning method, seasoning plate, and semiconductor polishing device

MARUOKA DAISUKE1 citations33