Inventor

HU PING-CHENG

TW10 patents

⚠️ This page may combine multiple inventors who share the name “HU PING-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG CHIEN PAO-HUEI

4 patents

US8120152B2Feb 21, 2012

Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

CHANG CHIEN PAO-HUEI26 citations91

US8237250B2Aug 7, 2012

Advanced quad flat non-leaded package structure and manufacturing method thereof

CHANG CHIEN PAO-HUEI21 citations89

US8124447B2Feb 28, 2012

Manufacturing method of advanced quad flat non-leaded package

CHANG CHIEN PAO-HUEI24 citations89

US8106492B2Jan 31, 2012

Semiconductor package and manufacturing method thereof

CHANG CHIEN PAO-HUEI25 citations89

ADVANCED SEMICONDUCTOR ENG

2 patents

US9059379B2Jun 16, 2015

Light-emitting semiconductor packages and related methods

ADVANCED SEMICONDUCTOR ENG3 citations60

US8994156B2Mar 31, 2015

Semiconductor device packages with solder joint enhancement elements

ADVANCED SEMICONDUCTOR ENG0 citations50

CHEN CHIEN-WEN

1 patent

US8115285B2Feb 14, 2012

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

CHEN CHIEN-WEN22 citations89

CHIEN PAO-HUEI CHANG

1 patent

US8492883B2Jul 23, 2013

Semiconductor package having a cavity structure

CHIEN PAO-HUEI CHANG17 citations85

CHIANG PO-SHING

1 patent

US8502363B2Aug 6, 2013

Semiconductor device packages with solder joint enhancement element and related methods

CHIANG PO-SHING8 citations78

YU LIN-WANG

1 patent

US8674487B2Mar 18, 2014

Semiconductor packages with lead extensions and related methods

YU LIN-WANG12 citations74