Inventor
SONG EUNSEOK
KR26 patents
⚠️ This page may combine multiple inventors who share the name “SONG EUNSEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
18 patentsUS11862618B2Jan 2, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations84
US8350158B2Jan 8, 2013
Tape wiring substrates and packages including the same
SAMSUNG ELECTRONICS CO LTD11 citations83
US11984421B2May 14, 2024
Integrated circuit chip having BS-PDN structure
SAMSUNG ELECTRONICS CO LTD3 citations70
US11631660B2Apr 18, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations68
US12489083B2Dec 2, 2025
3D laminated chip, and semiconductor package including the 3D laminated chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US12237308B2Feb 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12040304B2Jul 16, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11901336B2Feb 13, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11837577B2Dec 5, 2023
System-in-package module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11532591B2Dec 20, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11398454B2Jul 26, 2022
System-in-package module
SAMSUNG ELECTRONICS CO LTD0 citations62
US12308363B2May 20, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11996398B2May 28, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11482516B2Oct 25, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations59
US12211829B2Jan 28, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US12166010B2Dec 10, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US11887965B2Jan 30, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US12057441B2Aug 6, 2024
Semiconductor package including a plurality of semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations50
GCT SEMICONDUCTOR INC
7 patentsUS6553089B2Apr 22, 2003
Fractional-N frequency synthesizer with fractional compensation method
GCT SEMICONDUCTOR INC59 citations95
US6850748B2Feb 1, 2005
RF front end with reduced carrier leakage
GCT SEMICONDUCTOR INC25 citations92
US6704383B2Mar 9, 2004
Sample and hold type fractional-N frequency synthesizer
GCT SEMICONDUCTOR INC38 citations92
US6952125B2Oct 4, 2005
System and method for suppressing noise in a phase-locked loop circuit
GCT SEMICONDUCTOR INC27 citations91
US6963620B2Nov 8, 2005
Communication transmitter using offset phase-locked-loop
GCT SEMICONDUCTOR INC8 citations74
US7812672B2Oct 12, 2010
Low noise amplifier having improved linearity
GCT SEMICONDUCTOR INC3 citations61
US7535977B2May 19, 2009
Sigma-delta based phase lock loop
GCT SEMICONDUCTOR INC0 citations40