Inventor
OH KYUNGSUK
KR15 patents
Patents
15 patentsUS11984421B2May 14, 2024
Integrated circuit chip having BS-PDN structure
SAMSUNG ELECTRONICS CO LTD3 citations70
US11101243B2Aug 24, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations70
US12009303B2Jun 11, 2024
Integrated circuit semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations68
US11631660B2Apr 18, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations68
US10699056B1Jun 30, 2020
Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit board
SAMSUNG ELECTRONICS CO LTD1 citations61
US12388048B2Aug 12, 2025
Semiconductor package comprising heat spreader
SAMSUNG ELECTRONICS CO LTD0 citations59
US11996398B2May 28, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11742329B2Aug 29, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11482516B2Oct 25, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations59
US12211829B2Jan 28, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US12237268B2Feb 25, 2025
Integrated circuit semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations56
US12199002B2Jan 14, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12057441B2Aug 6, 2024
Semiconductor package including a plurality of semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations50
US11482507B2Oct 25, 2022
Semiconductor package having molding member and heat dissipation member
SAMSUNG ELECTRONICS CO LTD0 citations50
US11257786B2Feb 22, 2022
Semiconductor package including molding member, heat dissipation member, and reinforcing member
SAMSUNG ELECTRONICS CO LTD0 citations50