Inventor
LIU CHANG-MIAO
TW63 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHANG-MIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
49 patentsUS11769819B2Sep 26, 2023
Semiconductor device structure with metal gate stack
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US11139432B1Oct 5, 2021
Methods of forming a FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations85
US11121236B2Sep 14, 2021
Semiconductor device with air spacer and stress liner
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11107736B1Aug 31, 2021
Gate structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11916105B2Feb 27, 2024
Semiconductor device with corner isolation protection and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US12166075B2Dec 10, 2024
Method and structure for gate-all-around devices
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11948998B2Apr 2, 2024
Isolation structures in multi-gate semiconductor devices and methods of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11854906B2Dec 26, 2023
Gate structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11444179B2Sep 13, 2022
Isolation structures in multi-gate semiconductor devices and methods of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10868174B1Dec 15, 2020
Devices with strained isolation features
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10347720B2Jul 9, 2019
Doping for semiconductor device with conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US12166071B2Dec 10, 2024
Dielectric fins with air gap and backside self-aligned contact
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11387146B2Jul 12, 2022
Semiconductor device with air gaps between metal gates and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11075283B2Jul 27, 2021
Dielectric constant reduction of gate spacer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations67
US12349432B2Jul 1, 2025
Enlarged backside contact
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12349384B2Jul 1, 2025
Isolation structures in multi-gate semiconductor devices and methods of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12317550B2May 27, 2025
Methods of forming a semiconductor device with corner isolation protection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12218013B2Feb 4, 2025
Gate structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12132096B2Oct 29, 2024
Semiconductor device structure with metal gate stack
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12113118B2Oct 8, 2024
Stress-inducing silicon liner in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12100625B2Sep 24, 2024
Semiconductor device with air gaps between metal gates and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015055B2Jun 18, 2024
Doping for semiconductor device with conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11991936B2May 21, 2024
Method of forming a FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11935954B2Mar 19, 2024
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855155B2Dec 26, 2023
Semiconductor device having contact feature and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11837662B2Dec 5, 2023
Devices with strained isolation features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756835B2Sep 12, 2023
Semiconductor device with air gaps between metal gates and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742386B2Aug 29, 2023
Doping for semiconductor device with conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728405B2Aug 15, 2023
Stress-inducing silicon liner in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11594680B2Feb 28, 2023
Method of forming a FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11450741B2Sep 20, 2022
Doping for semiconductor device with conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11430890B2Aug 30, 2022
Integrated circuits with channel-strain liner
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11302784B2Apr 12, 2022
Semiconductor device having contact feature and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11133386B2Sep 28, 2021
Multi-layer fin structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10840375B2Nov 17, 2020
Integrated circuits with channel-strain liner
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12550358B2Feb 10, 2026
Method of forming transistors of different configurations
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12527050B2Jan 13, 2026
Integrated circuit structure with source/drain spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12414331B2Sep 9, 2025
Isolation for multigate devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12363935B2Jul 15, 2025
Methods for forming multi-gate transistors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12356703B2Jul 8, 2025
Air spacer formation for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12324218B2Jun 3, 2025
Semiconductor devices with air gaps and the method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12183806B2Dec 31, 2024
Semiconductor devices and methods of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11973128B2Apr 30, 2024
Methods for forming multi-gate transistors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11837631B2Dec 5, 2023
Source/drain spacer with air gap in semiconductor devices and methods of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11715803B2Aug 1, 2023
Method of forming transistors of different configurations
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11688768B2Jun 27, 2023
Integrated circuit structure with source/drain spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11600695B2Mar 7, 2023
Dielectric fins with air gap and backside self-aligned contact
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11527444B2Dec 13, 2022
Air spacer formation for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11362217B1Jun 14, 2022
Method of forming transistors of different configurations
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
UNITED MICROELECTRONICS CORP
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