Inventor
CHOU HUNG-YU
TW15 patents
⚠️ This page may combine multiple inventors who share the name “CHOU HUNG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
13 patentsUS12040197B2Jul 16, 2024
Mechanical couplings designed to resolve process constraints
TEXAS INSTRUMENTS INC0 citations60
US11973052B2Apr 30, 2024
Stud bump for wirebonding high voltage isolation barrier connection
TEXAS INSTRUMENTS INC0 citations59
US11942448B2Mar 26, 2024
Integrated circuit die pad cavity
TEXAS INSTRUMENTS INC0 citations59
US12532752B2Jan 20, 2026
Packages with multiple exposed pads
TEXAS INSTRUMENTS INC0 citations58
US11735506B2Aug 22, 2023
Packages with multiple exposed pads
TEXAS INSTRUMENTS INC0 citations58
US11862538B2Jan 2, 2024
Semiconductor die mounted in a recess of die pad
TEXAS INSTRUMENTS INC0 citations56
US11742265B2Aug 29, 2023
Exposed heat-generating devices
TEXAS INSTRUMENTS INC0 citations56
US11421981B2Aug 23, 2022
Single wavelength reflection for leadframe brightness measurement
TEXAS INSTRUMENTS INC0 citations54
US10340152B1Jul 2, 2019
Mechanical couplings designed to resolve process constraints
TEXAS INSTRUMENTS INC0 citations49
US11848297B2Dec 19, 2023
Semiconductor device packages with high angle wire bonding and non-gold bond wires
TEXAS INSTRUMENTS INC0 citations46
US11948721B2Apr 2, 2024
Packaged isolation barrier with integrated magnetics
TEXAS INSTRUMENTS INC0 citations44
US10429174B2Oct 1, 2019
Single wavelength reflection for leadframe brightness measurement
TEXAS INSTRUMENTS INC0 citations44
US10861777B2Dec 8, 2020
Wire bond clamp design and lead frame capable of engaging with same
TEXAS INSTRUMENTS INC0 citations38