Inventor

TAO ZHENG

BE23 patents

⚠️ This page may combine multiple inventors who share the name “TAO ZHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAO ZHENG

IMEC VZW

Method of fabricating stacked semiconductor device

Method for patterning a substrate involving directed self-assembly

Method for forming a field effect transistor device having an electrical contact

Buried power rail contact formation

Method and structure for determining an overlay error

Contact isolation in semiconductor devices

Method for filling a space in a semiconductor

Interconnection structure for a semiconductor device

Method for forming a buried metal line in a semiconductor substrate

Method of forming a mask layer

Method of forming internal spacer for nanowires

Method for producing a buried interconnect rail of an integrated circuit chip

Method of forming micro-pipes on a substrate and a structure formed thereof

Method of manufacturing an interconnection structure for a semiconductor device having a spacer separating first and second conductive lines

Self-aligned nanostructures for semiconductor devices

Method for producing a pillar structure in a semiconductor layer

Method of providing an implanted region in a semiconductor structure

Method for forming horizontal nanowires and devices manufactured thereof

Method for patterning an underlying layer

BYD CO LTD

Bus

Bus

UNISANTIS ELECT SINGAPORE PTE

Pillar-shaped semiconductor device and method for producing the same

STARSE ENERGY AND TECH GROUP CO LTD

Sand control screen for heavy oil thermal recovery