Inventor
KIM DANIEL DAEIK
US16 patents
⚠️ This page may combine multiple inventors who share the name “KIM DANIEL DAEIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
15 patentsUS11515247B2Nov 29, 2022
Capacitance fine tuning by fin capacitor design
QUALCOMM INC2 citations71
US11011461B2May 18, 2021
Perpendicular inductors integrated in a substrate
QUALCOMM INC4 citations70
US10903240B2Jan 26, 2021
Integrated circuits (ICs) on a glass substrate
QUALCOMM INC0 citations62
US12519050B2Jan 6, 2026
Double-sided redistribution layer (RDL) substrate for passive and device integration
QUALCOMM INC0 citations60
US12016247B2Jun 18, 2024
Package comprising an integrated passive device configured as a cap for a filter
QUALCOMM INC0 citations60
US12009292B2Jun 11, 2024
Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation
QUALCOMM INC0 citations60
US11728293B2Aug 15, 2023
Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component
QUALCOMM INC0 citations60
US11658403B2May 23, 2023
Device, package and/or substrate comprising curved antenna
QUALCOMM INC1 citations60
US11502652B2Nov 15, 2022
Substrate comprising capacitor configured for power amplifier output match
QUALCOMM INC0 citations60
US11239158B1Feb 1, 2022
Wire bond inductor structures for flip chip dies
QUALCOMM INC0 citations60
US11770115B2Sep 26, 2023
Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methods
QUALCOMM INC1 citations56
US10879191B2Dec 29, 2020
Conformal shielding for solder ball array
QUALCOMM INC0 citations51
US11817239B2Nov 14, 2023
Embedded vertical inductor in laminate stacked substrates
QUALCOMM INC0 citations49
US11380471B2Jul 5, 2022
RF damping structure in inductive device
QUALCOMM INC0 citations49
US10319694B2Jun 11, 2019
Semiconductor assembly and method of making same
QUALCOMM INC0 citations41