Inventor
Huang Tzu-Yun
TW10 patents
⚠️ This page may combine multiple inventors who share the name “Huang Tzu-Yun”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS10163832B1Dec 25, 2018
Integrated fan-out package, redistribution circuit structure, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations82
US11004812B2May 11, 2021
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12347791B2Jul 1, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11387191B2Jul 12, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10074623B2Sep 11, 2018
Method of fabricating redistribution circuit structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9899342B2Feb 20, 2018
Integrated fan-out package, redistribution circuit structure, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
WINBOND ELECTRONICS CORP
3 patentsUS12432914B2Sep 30, 2025
Non-volatile memory structure and method for forming the same
WINBOND ELECTRONICS CORP0 citations61
US11362272B2Jun 14, 2022
Resistive memory device and reliability enhancement method thereof by using ratio of set current and reference current
WINBOND ELECTRONICS CORP0 citations60
US12527037B2Jan 13, 2026
Semiconductor device with floating gate, and method for manufacturing the same
WINBOND ELECTRONICS CORP0 citations59