Inventor

KOMPOSCH ALEXANDER

US40 patents

⚠️ This page may combine multiple inventors who share the name “KOMPOSCH ALEXANDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOMPOSCH ALEXANDER

WOLFSPEED INC

Multi-zone radio frequency transistor amplifiers

Radio frequency amplifiers having improved shunt matching circuits

Packaged transistor having die attach materials with channels and process of implementing the same

Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys

RF amplifiers having shielded transmission line structures

Methods for dicing semiconductor wafers having a metallization layer and semiconductor devices made by the methods

Multi-cavity package having single metal flange

Integrated passive device (IPD) components and a package and processes implementing the same

Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same

Packaged semiconductor devices, and package molds for forming packaged semiconductor devices

RF amplifier devices including interconnect structures and methods of manufacturing

Thermal and electrical conductivity between metal contacts utilizing spring pin connectors

CREE INC

Methods for dicing semiconductor wafers and semiconductor devices made by the methods

Device carrier configured for interconnects, a package implementing a device carrier having interconnects, and processes of making the same

Multi-cavity package having single metal flange

High reliability semiconductor devices and methods of fabricating the same

Packaging for RF transistor amplifiers

Die-attach method to compensate for thermal expansion

Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys

Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations

Package with different types of semiconductor dies attached to a flange

Integrated circuit having die attach materials with channels and process of implementing the same

Package with different types of semiconductor dies attached to a flange

Integrated passive device (IPD) components and a package and processes implementing the same

MACOM TECH SOLUTIONS HOLDINGS INC

RF amplifiers having shielded transmission line structures

RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections

Packaged semiconductor devices with leadframes having tie bar with recessed cavity

Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages

Packaged RF power device with PCB routing outside protective member

Multi-zone radio frequency transistor amplifiers

RF amplifier devices including top side contacts and methods of manufacturing

INFINEON TECHNOLOGIES AG

Air cavity package with copper heat sink and ceramic window frame

Semiconductor package having a baseplate with a die attach region and a peripheral region

Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange

Flange for semiconductor die

Semiconductor device package having asymmetric chip mounting area and lead widths

KOMPOSCH ALEXANDER

PCB based RF-power package window frame

MOHAMMED ANWAR A

Flange for semiconductor die

OTREMBA RALF

Semiconductor chip, semiconductor device and methods for producing the same

INFINEON TECHNOLOGIES CORP

Hybrid semiconductor package