Inventor
HUNG KUO-CHIN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “HUNG KUO-CHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
12 patentsUS9887158B1Feb 6, 2018
Conductive structure having an entrenched high resistive layer
UNITED MICROELECTRONICS CORP5 citations83
US9755047B2Sep 5, 2017
Semiconductor process and semiconductor device
UNITED MICROELECTRONICS CORP2 citations73
US9735015B1Aug 15, 2017
Fabricating method of semiconductor structure
UNITED MICROELECTRONICS CORP2 citations72
US9640482B1May 2, 2017
Semiconductor device with a contact plug and method of fabricating the same
UNITED MICROELECTRONICS CORP6 citations72
US9853123B2Dec 26, 2017
Semiconductor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP4 citations70
US10388788B2Aug 20, 2019
Semiconductor device and method of forming the same
UNITED MICROELECTRONICS CORP2 citations69
US9502303B2Nov 22, 2016
Method for manufacturing semiconductor device with a barrier layer having overhung portions
UNITED MICROELECTRONICS CORP2 citations62
US11705492B2Jul 18, 2023
Method for fabricating semiconductor structure
UNITED MICROELECTRONICS CORP0 citations61
US11031477B2Jun 8, 2021
Method for fabricating semiconductor structure
UNITED MICROELECTRONICS CORP0 citations61
US9985110B2May 29, 2018
Semiconductor process
UNITED MICROELECTRONICS CORP0 citations52
US10541309B2Jan 21, 2020
Semiconductor structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations51
US10192826B2Jan 29, 2019
Conductive layout structure including high resistive layer
UNITED MICROELECTRONICS CORP0 citations51