Inventor
TUMMALA RAO R
US24 patents
⚠️ This page may combine multiple inventors who share the name “TUMMALA RAO R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS4234367ANov 18, 1980
Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
IBM91 citations96
US4221047ASep 9, 1980
Multilayered glass-ceramic substrate for mounting of semiconductor device
IBM178 citations96
US4413061ANov 1, 1983
Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
IBM73 citations95
US4301324ANov 17, 1981
Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
IBM107 citations95
US5196251AMar 23, 1993
Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate
IBM67 citations93
US4224627ASep 23, 1980
Seal glass for nozzle assemblies of an ink jet printer
IBM28 citations81
US5304517AApr 19, 1994
Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering
IBM11 citations73
US4122460AOct 24, 1978
Ink jet nozzle structures
IBM10 citations73
US3982918ASep 28, 1976
Process for preparing a copper containing sealing glass
IBM8 citations72
US4504340AMar 12, 1985
Material and process set for fabrication of molecular matrix print head
IBM3 citations63
GEORGIA TECH RES INST
9 patentsUS6261941B1Jul 17, 2001
Method for manufacturing a multilayer wiring substrate
GEORGIA TECH RES INST50 citations87
US9417415B2Aug 16, 2016
Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate
GEORGIA TECH RES INST9 citations84
US7262075B2Aug 28, 2007
High-aspect-ratio metal-polymer composite structures for nano interconnects
GEORGIA TECH RES INST10 citations82
US10672718B2Jun 2, 2020
Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same
GEORGIA TECH RES INST6 citations81
US7557448B2Jul 7, 2009
High-aspect-ratio metal-polymer composite structures for nano interconnects
GEORGIA TECH RES INST5 citations72
US12315787B2May 27, 2025
Embedded semiconductor packages and methods thereof
GEORGIA TECH RES INST0 citations60
US12027453B2Jul 2, 2024
Embedded semiconductor packages and methods thereof
GEORGIA TECH RES INST0 citations60
US7556189B2Jul 7, 2009
Lead-free bonding systems
GEORGIA TECH RES INST1 citations47
US11756985B2Sep 12, 2023
Substrate-compatible inductors with magnetic layers
GEORGIA TECH RES INST0 citations45