Inventor
YEH WEI-TING
TW14 patents
⚠️ This page may combine multiple inventors who share the name “YEH WEI-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS12550720B2Feb 10, 2026
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12347717B2Jul 1, 2025
Debonding structures for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12412775B2Sep 9, 2025
Isolation structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12512439B2Dec 30, 2025
Wafer bonding method and semiconductor structure obtained by the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12575141B2Mar 10, 2026
Metal-comprising bottom isolation structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US12489082B2Dec 2, 2025
Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49