Inventor
LAI Chaung-Lin
TW6 patents
Patents
6 patentsUS9997473B2Jun 12, 2018
Chip package and method for forming the same
XINTEC INC2 citations71
US12272712B2Apr 8, 2025
Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region
XINTEC INC0 citations61
US12237354B2Feb 25, 2025
Chip package and method for forming the same
XINTEC INC0 citations61
US11746003B2Sep 5, 2023
Chip package
XINTEC INC0 citations61
US11319208B2May 3, 2022
Chip package and manufacturing method thereof
XINTEC INC0 citations61
US10461117B2Oct 29, 2019
Semiconductor structure and method for manufacturing semiconductor structure
XINTEC INC0 citations40