Inventor
WOOD DUSTIN
US3 patents
Patents
3 patentsUS6501166B2Dec 31, 2002
Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance
INTEL CORP19 citations89
US6429051B1Aug 6, 2002
Stitched plane structure for package power delivery and dual referenced stripline I/O performance
INTEL CORP10 citations70
US6867491B2Mar 15, 2005
Metal core integrated circuit package with electrically isolated regions and associated methods
INTEL CORP3 citations59