Inventor
ONG SENG HOOI
ML3 patents
Patents
3 patentsUS6664483B2Dec 16, 2003
Electronic package with high density interconnect and associated methods
INTEL CORP53 citations92
US6501166B2Dec 31, 2002
Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance
INTEL CORP19 citations89
US6429051B1Aug 6, 2002
Stitched plane structure for package power delivery and dual referenced stripline I/O performance
INTEL CORP10 citations70