Inventor
SCHROCK EDWARD A
US15 patents
Patents
15 patentsUS6616864B1Sep 9, 2003
Z-axis electrical contact for microelectronic devices
MICRON TECHNOLOGY INC107 citations99
US6699928B2Mar 2, 2004
Adhesive composition for use in packaging applications
MICRON TECHNOLOGY INC72 citations98
US6210992B1Apr 3, 2001
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC172 citations98
US6541872B1Apr 1, 2003
Multi-layered adhesive for attaching a semiconductor die to a substrate
MICRON TECHNOLOGY INC61 citations96
US6770164B1Aug 3, 2004
Method for attaching a semiconductor die to a substrate
MICRON TECHNOLOGY INC29 citations92
US6707152B1Mar 16, 2004
Semiconductor device, electrical conductor system, and method of making
MICRON TECHNOLOGY INC25 citations92
US6646354B2Nov 11, 2003
Adhesive composition and methods for use in packaging applications
MICRON TECHNOLOGY INC18 citations92
US6521980B1Feb 18, 2003
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC25 citations92
US5962862AOct 5, 1999
Method and apparatus for verifying the presence or absence of a component
MICRON TECHNOLOGY INC43 citations92
US6709896B1Mar 23, 2004
Methods for use in packaging applications using an adhesive composition
MICRON TECHNOLOGY INC15 citations84
US6118080ASep 12, 2000
Z-axis electrical contact for microelectronic devices
MICRON TECHNOLOGY INC7 citations74
US6395579B2May 28, 2002
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC10 citations73
US6352925B1Mar 5, 2002
Method of making electrical conductor system for semiconductor device
MICRON TECHNOLOGY INC7 citations73
US6662440B1Dec 16, 2003
Z-axis electrical contact for microelectric devices
MICRON TECHNOLOGY INC2 citations63
US7213331B2May 8, 2007
Method for forming stencil
MICRON TECHNOLOGY INC0 citations52