Inventor
BARBER IVOR G
US11 patents
⚠️ This page may combine multiple inventors who share the name “BARBER IVOR G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
6 patentsUS5801072ASep 1, 1998
Method of packaging integrated circuits
LSI LOGIC CORP180 citations97
US5723369AMar 3, 1998
Method of flip chip assembly
LSI LOGIC CORP140 citations96
US6590292B1Jul 8, 2003
Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill
LSI LOGIC CORP49 citations95
US5700723ADec 23, 1997
Method of packaging an integrated circuit
LSI LOGIC CORP24 citations91
US6673708B1Jan 6, 2004
Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill
LSI LOGIC CORP11 citations72
US6943446B2Sep 13, 2005
Via construction for structural support
LSI LOGIC CORP4 citations62
XILINX INC
5 patentsUS10529645B2Jan 7, 2020
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
XILINX INC26 citations93
US10043730B2Aug 7, 2018
Stacked silicon package assembly having an enhanced lid
XILINX INC19 citations92
US10319606B1Jun 11, 2019
Chip package assembly with enhanced interconnects and method for fabricating the same
XILINX INC2 citations72
US10527670B2Jan 7, 2020
Testing system for lid-less integrated circuit packages
XILINX INC0 citations51
US10096502B2Oct 9, 2018
Method and apparatus for assembling and testing a multi-integrated circuit package
XILINX INC0 citations51