Inventor
WERMER PAUL H
US12 patents
Patents
12 patentsUS6555906B2Apr 29, 2003
Microelectronic package having a bumpless laminated interconnection layer
INTEL CORP273 citations98
US7067356B2Jun 27, 2006
Method of fabricating microelectronic package having a bumpless laminated interconnection layer
INTEL CORP79 citations97
US6840777B2Jan 11, 2005
Solderless electronics packaging
INTEL CORP68 citations97
US6775150B1Aug 10, 2004
Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
INTEL CORP70 citations96
US6829133B2Dec 7, 2004
Capacitor
INTEL CORP41 citations94
US6605551B2Aug 12, 2003
Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
INTEL CORP74 citations94
US7159313B2Jan 9, 2007
Solderless electronics packaging and methods of manufacture
INTEL CORP23 citations92
US7120031B2Oct 10, 2006
Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors
INTEL CORP26 citations92
US7535728B2May 19, 2009
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors
INTEL CORP8 citations84
US7136275B2Nov 14, 2006
Polymeric dielectric material for high-energy density capacitors
INTEL CORP11 citations84
US6480370B1Nov 12, 2002
Polymeric dielectric material for high-energy density capacitors
INTEL CORP12 citations74
US7348496B2Mar 25, 2008
Circuit board with organic dielectric layer
INTEL CORP7 citations72