Inventor
NASU HIDEHISA
JP4 patents
Patents
4 patentsUS7405107B2Jul 29, 2008
Semiconductor device, method and apparatus for fabricating the same
DENSO CORP12 citations80
US7300274B2Nov 27, 2007
Change-over device for changing over between a heating medium and a resin material at a time of a secondary forming
DENSO CORP4 citations59
US7459118B2Dec 2, 2008
Heated medium supplying method and structure for secondary molding of resin molded component
DENSO CORP1 citations48
US7438842B2Oct 21, 2008
Method of manufacturing resin molding and change-over device for changing over between heating medium and resin material in process of secondary forming
DENSO CORP1 citations48