Inventor
TONG QIN-YI
US43 patents
⚠️ This page may combine multiple inventors who share the name “TONG QIN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZIPTRONIX INC
26 patentsUS9391143B2Jul 12, 2016
Method for low temperature bonding and bonded structure
ZIPTRONIX INC117 citations99
US9331149B2May 3, 2016
Method for low temperature bonding and bonded structure
ZIPTRONIX INC185 citations99
US9171756B2Oct 27, 2015
3D IC method and device
ZIPTRONIX INC232 citations99
US7485968B2Feb 3, 2009
3D IC method and device
ZIPTRONIX INC433 citations99
US7387944B2Jun 17, 2008
Method for low temperature bonding and bonded structure
ZIPTRONIX INC68 citations99
US7109092B2Sep 19, 2006
Method of room temperature covalent bonding
ZIPTRONIX INC331 citations99
US7041178B2May 9, 2006
Method for low temperature bonding and bonded structure
ZIPTRONIX INC129 citations99
US6902987B1Jun 7, 2005
Method for low temperature bonding and bonded structure
ZIPTRONIX INC227 citations99
US6563133B1May 13, 2003
Method of epitaxial-like wafer bonding at low temperature and bonded structure
ZIPTRONIX INC185 citations99
US9716033B2Jul 25, 2017
3D IC method and device
ZIPTRONIX INC29 citations98
US9385024B2Jul 5, 2016
Room temperature metal direct bonding
ZIPTRONIX INC211 citations98
US6962835B2Nov 8, 2005
Method for room temperature metal direct bonding
ZIPTRONIX INC235 citations98
US9082627B2Jul 14, 2015
Method for low temperature bonding and bonded structure
ZIPTRONIX INC20 citations96
US7807549B2Oct 5, 2010
Method for low temperature bonding and bonded structure
ZIPTRONIX INC41 citations96
US7602070B2Oct 13, 2009
Room temperature metal direct bonding
ZIPTRONIX INC33 citations96
US7553744B2Jun 30, 2009
Method for low temperature bonding and bonded structure
ZIPTRONIX INC35 citations96
US7335572B2Feb 26, 2008
Method for low temperature bonding and bonded structure
ZIPTRONIX INC39 citations96
US8709938B2Apr 29, 2014
3D IC method and device
ZIPTRONIX INC13 citations93
US8053329B2Nov 8, 2011
Method for low temperature bonding and bonded structure
ZIPTRONIX INC7 citations93
US7871898B2Jan 18, 2011
Method for low temperature bonding and bonded structure
ZIPTRONIX INC9 citations93
US7862885B2Jan 4, 2011
Method of room temperature covalent bonding
ZIPTRONIX INC11 citations93
US7462552B2Dec 9, 2008
Method of detachable direct bonding at low temperatures
ZIPTRONIX INC42 citations93
US7335996B2Feb 26, 2008
Method of room temperature covalent bonding
ZIPTRONIX INC15 citations93
US7332410B2Feb 19, 2008
Method of epitaxial-like wafer bonding at low temperature and bonded structure
ZIPTRONIX INC23 citations93
US7842540B2Nov 30, 2010
Room temperature metal direct bonding
ZIPTRONIX INC11 citations92
US8846450B2Sep 30, 2014
Room temperature metal direct bonding
ZIPTRONIX INC5 citations79
INVENSAS BONDING TECH INC
7 patentsUS10434749B2Oct 8, 2019
Method of room temperature covalent bonding
INVENSAS BONDING TECH INC60 citations98
US10147641B2Dec 4, 2018
3D IC method and device
INVENSAS BONDING TECH INC47 citations98
US11011418B2May 18, 2021
3D IC method and device
INVENSAS BONDING TECH INC5 citations84
US10312217B2Jun 4, 2019
Method for low temperature bonding and bonded structure
INVENSAS BONDING TECH INC3 citations84
US10141218B2Nov 27, 2018
Room temperature metal direct bonding
INVENSAS BONDING TECH INC5 citations84
US11760059B2Sep 19, 2023
Method of room temperature covalent bonding
INVENSAS BONDING TECH INC1 citations73
US11289372B2Mar 29, 2022
3D IC method and device
INVENSAS BONDING TECH INC2 citations73
TONG QIN-YI
4 patentsUS8841002B2Sep 23, 2014
Method of room temperature covalent bonding
TONG QIN-YI198 citations99
US8524533B2Sep 3, 2013
Room temperature metal direct bonding
TONG QIN-YI217 citations98
US8153505B2Apr 10, 2012
Method for low temperature bonding and bonded structure
TONG QIN-YI27 citations96
US8163373B2Apr 24, 2012
Method of room temperature covalent bonding
TONG QIN-YI18 citations92