Inventor
CHIEN CHIH-YUAN
TW26 patents
⚠️ This page may combine multiple inventors who share the name “CHIEN CHIH-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AU OPTRONICS CORP
13 patentsUS7283603B1Oct 16, 2007
Shift register with four phase clocks
AU OPTRONICS CORP17 citations84
US7916108B2Mar 29, 2011
Liquid crystal display panel with color washout improvement and applications of same
AU OPTRONICS CORP8 citations83
US7898558B2Mar 1, 2011
Gate driving circuit and driving circuit unit thereof
AU OPTRONICS CORP10 citations82
US7734003B2Jun 8, 2010
Shift register arrays
AU OPTRONICS CORP11 citations82
US7728945B2Jun 1, 2010
Structure for circuit assembly
AU OPTRONICS CORP9 citations81
US7949085B2May 24, 2011
Stressless shift register
AU OPTRONICS CORP3 citations62
US7928942B2Apr 19, 2011
Signal-driving system and shift register unit thereof
AU OPTRONICS CORP6 citations62
US7924259B2Apr 12, 2011
Shift register array, and display apparatus
AU OPTRONICS CORP4 citations62
US7872506B2Jan 18, 2011
Gate driver and method for making same
AU OPTRONICS CORP1 citations52
US8896591B2Nov 25, 2014
Pixel circuit
AU OPTRONICS CORP0 citations51
US7847778B2Dec 7, 2010
Gate driving circuit and driving method thereof
AU OPTRONICS CORP1 citations51
US8373811B2Feb 12, 2013
Liquid crystal display device with each pixel having plural capacitors coupling to switches and related driving method
AU OPTRONICS CORP0 citations40
US7633570B2Dec 15, 2009
Liquid crystal display with uniform feed-through voltage
AU OPTRONICS CORP0 citations35
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS11296051B2Apr 5, 2022
Semiconductor packages and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US10867955B2Dec 15, 2020
Package structure having adhesive layer surrounded dam structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12230609B2Feb 18, 2025
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10510591B1Dec 17, 2019
Package-on-package structure and method of manufacturing package
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10867849B2Dec 15, 2020
Package-on-package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52