Inventor
PARK HAE-JOONG
KR3 patents
Patents
3 patentsUS7869185B2Jan 11, 2011
Method of de-chucking wafer using direct voltage and alternating voltage, and apparatus for fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD7 citations81
US11501987B2Nov 15, 2022
Loadlock module and semiconductor manufacturing apparatus including the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US10971382B2Apr 6, 2021
Loadlock module and semiconductor manufacturing apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations71