Inventor

JANG DONG-HYUN

KR10 patents

⚠️ This page may combine multiple inventors who share the name “JANG DONG-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG HYUN-SOO

3 patents

US8426252B2Apr 23, 2013

Wafer level package having a stress relief spacer and manufacturing method thereof

CHUNG HYUN-SOO5 citations83

US8232644B2Jul 31, 2012

Wafer level package having a stress relief spacer and manufacturing method thereof

CHUNG HYUN-SOO1 citations62

US8120177B2Feb 21, 2012

Wafer level package having a stress relief spacer and manufacturing method thereof

CHUNG HYUN-SOO1 citations62

SAMSUNG ELECTRONICS CO LTD

2 patents

US7572673B2Aug 11, 2009

Wafer level package having a stress relief spacer and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD18 citations92

US7838992B2Nov 23, 2010

Wafer level package having a stress relief spacer and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD6 citations73

AUTOLIV DEV

2 patents

US11760296B2Sep 19, 2023

Vehicular airbag device

AUTOLIV DEV0 citations62

US12319223B2Jun 3, 2025

Driver seat airbag device for vehicle and method for manufacturing same

AUTOLIV DEV1 citations54

LEE HO-JIN

1 patent

US8415804B2Apr 9, 2013

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

LEE HO-JIN7 citations83

GI CELL INC

1 patent

US12115261B2Oct 15, 2024

Block copolymer comprising hydrophilic first block, hydrophobic second block, and functional group capable of specifically binding to thiol

GI CELL INC0 citations49

MI SEOJIN INC

1 patent

US12108674B2Oct 1, 2024

Parallel thermoelectric module

MI SEOJIN INC0 citations43