Inventor
CHUAH TIN POAY
MY40 patents
⚠️ This page may combine multiple inventors who share the name “CHUAH TIN POAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
39 patentsUS11355427B2Jun 7, 2022
Device, method and system for providing recessed interconnect structures of a substrate
INTEL CORP14 citations85
US11375617B2Jun 28, 2022
Three dimensional foldable substrate with vertical side interface
INTEL CORP3 citations73
US10840177B2Nov 17, 2020
Interposer with flexible portion
INTEL CORP2 citations73
US11006514B2May 11, 2021
Three-dimensional decoupling integration within hole in motherboard
INTEL CORP3 citations72
US10856454B2Dec 1, 2020
Electromagnetic interference (EMI) shield for circuit card assembly (CCA)
INTEL CORP3 citations71
US10772206B2Sep 8, 2020
Board to board interconnect
INTEL CORP1 citations70
US10356902B2Jul 16, 2019
Board to board interconnect
INTEL CORP3 citations70
US10701796B2Jun 30, 2020
Electromagnetic interference (EMI) shield
INTEL CORP2 citations66
US12328816B2Jun 10, 2025
Asymmetrical laminated circuit boards for improved electrical performance
INTEL CORP0 citations62
US12256487B2Mar 18, 2025
Hybrid boards with embedded planes
INTEL CORP0 citations62
US12250800B2Mar 11, 2025
Radiation shield with zipper
INTEL CORP0 citations62
US11942412B2Mar 26, 2024
Interposer with flexible portion
INTEL CORP0 citations62
US11758662B2Sep 12, 2023
Three dimensional foldable substrate with vertical side interface
INTEL CORP0 citations62
US11699664B2Jul 11, 2023
Wrappable EMI shields
INTEL CORP0 citations62
US11521943B2Dec 6, 2022
Method of forming a capacitive loop substrate assembly
INTEL CORP0 citations62
US11031359B2Jun 8, 2021
Capacitor loop structure
INTEL CORP0 citations62
US10211069B2Feb 19, 2019
Embedded package in PCB build up
INTEL CORP1 citations62
US12349276B2Jul 1, 2025
Co-planar interconnection mechanisms for circuit boards
INTEL CORP0 citations61
US11696409B2Jul 4, 2023
Vertical embedded component in a printed circuit board blind hole
INTEL CORP0 citations61
US11556157B2Jan 17, 2023
Diagonal printed circuit boards systems
INTEL CORP0 citations61
US11487326B2Nov 1, 2022
Elevated docking station for different mobile devices
INTEL CORP0 citations61
US11172581B2Nov 9, 2021
Multi-planar circuit board having reduced z-height
INTEL CORP0 citations61
US11304299B2Apr 12, 2022
Board to board interconnect
INTEL CORP0 citations60
US12061502B2Aug 13, 2024
Expandable thermal solution for laptops
INTEL CORP1 citations57
US10939540B2Mar 2, 2021
Shielded folded circuit board
INTEL CORP0 citations57
US12218042B2Feb 4, 2025
Via plug resistor
INTEL CORP0 citations56
US11343906B2May 24, 2022
Stacked scalable voltage regulator module for platform area miniaturization
INTEL CORP0 citations56
US12156331B2Nov 26, 2024
Technologies for power tunnels on circuit boards
INTEL CORP0 citations53
US10355384B2Jul 16, 2019
Integrated connector for electronic device
INTEL CORP1 citations53
US12033953B2Jul 9, 2024
Electronic device and crosstalk mitigating substrate
INTEL CORP0 citations52
US11178768B2Nov 16, 2021
Flexible printed circuit EMI enclosure
INTEL CORP0 citations52
US12424779B2Sep 23, 2025
Flexible printed circuit board arrangement
INTEL CORP0 citations51
US12309984B2May 20, 2025
Radiation shield and groove in support structure
INTEL CORP0 citations50
US11589460B2Feb 21, 2023
System in package dual connector
INTEL CORP0 citations50
US11481001B2Oct 25, 2022
System for dual displays
INTEL CORP0 citations50
US11445608B2Sep 13, 2022
Chassis interconnect for an electronic device
INTEL CORP0 citations48
US10297541B2May 21, 2019
Multiple-component substrate for a microelectronic device
INTEL CORP0 citations48
US12406916B2Sep 2, 2025
Via plug capacitor
INTEL CORP0 citations45
US12557216B2Feb 17, 2026
Type-3 printed circuit boards (PCBS) with hybrid layer counts
INTEL CORP0 citations41