Inventor
YANAGISAWA HIROHARU
JP9 patents
Patents
9 patentsUS9538664B2Jan 3, 2017
Wiring substrate
SHINKO ELECTRIC IND CO5 citations72
US9698094B2Jul 4, 2017
Wiring board and electronic component device
SHINKO ELECTRIC IND CO3 citations71
US12581905B2Mar 17, 2026
Substrate fixing device
SHINKO ELECTRIC IND CO1 citations61
US12532705B2Jan 20, 2026
Substrate fixing device
SHINKO ELECTRIC IND CO0 citations61
US11152293B2Oct 19, 2021
Wiring board having two insulating films and hole penetrating therethrough
SHINKO ELECTRIC IND CO1 citations61
US11456200B2Sep 27, 2022
Substrate fixing apparatus including a base plate, an electrostatic adsorption member, a plurality of support members on the base plate and supporting the electrostatic adsorption member, and an adhesive layer bonding the electrostatic adsorption member to the base plate
SHINKO ELECTRIC IND CO0 citations60
US11088006B2Aug 10, 2021
Electrostatic chuck
SHINKO ELECTRIC IND CO0 citations59
US9966331B2May 8, 2018
Wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO0 citations40
US9961767B2May 1, 2018
Circuit board and method of manufacturing circuit board
SHINKO ELECTRIC IND CO0 citations40