Inventor
CHEN CHIEN-YING
TW32 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIEN-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
22 patentsUS11803682B2Oct 31, 2023
Semiconductor device including standard cell having split portions
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US10741540B2Aug 11, 2020
Integrated circuit layout method and device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11574865B2Feb 7, 2023
Method of forming semiconductor device including deep vias
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11501051B2Nov 15, 2022
Memory device, integrated circuit device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11127673B2Sep 21, 2021
Semiconductor device including deep vias, and method of generating layout diagram for same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10396063B2Aug 27, 2019
Circuit with combined cells and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations72
US12430487B2Sep 30, 2025
Semiconductor device including standard cell having split portions
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300603B2May 13, 2025
Modified fuse structure and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12243867B2Mar 4, 2025
Integrated circuit device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12211791B2Jan 28, 2025
Semiconductor device including deep vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12089402B2Sep 10, 2024
Integrated circuit layout and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080641B2Sep 3, 2024
Electrical fuse bit cell in integrated circuit having backside conducting lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12039245B2Jul 16, 2024
Semiconductor device including standard cell having split portions
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854968B2Dec 26, 2023
Modified fuse structure and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11856760B2Dec 26, 2023
Bit cell with back-side metal line device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854966B2Dec 26, 2023
Method of forming semiconductor device including deep vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11837539B2Dec 5, 2023
Electrical fuse bit cell in integrated circuit having backside conducting lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776949B2Oct 3, 2023
Integrated circuit device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11696437B2Jul 4, 2023
Integrated circuit device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11355488B2Jun 7, 2022
Integrated circuit layout method, device, and system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342341B2May 24, 2022
Integrated circuit layout, method, structure, and system
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12361192B2Jul 15, 2025
Memory device, integrated circuit device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
ASUSTEK COMP INC
4 patentsUS8031465B2Oct 4, 2011
Electronic apparatus
ASUSTEK COMP INC9 citations82
US7645144B2Jan 12, 2010
Interface card and butterfly interface transfer structure
ASUSTEK COMP INC7 citations65
US7433189B2Oct 7, 2008
Electronic device and heat dissipation module thereof
ASUSTEK COMP INC6 citations62
US12487645B2Dec 2, 2025
Fixing assembly and electronic device
ASUSTEK COMP INC0 citations47
TECO IMAGE SYS CO LTD
4 patentsUS10065372B2Sep 4, 2018
Steel wire transmission system for three-dimensional printer and adjusting mechanism thereof
TECO IMAGE SYS CO LTD2 citations71
US9731493B2Aug 15, 2017
Printing platform supporting module and three-dimensional printer using same
TECO IMAGE SYS CO LTD3 citations71
US11549796B2Jan 10, 2023
Thickness measuring device
TECO IMAGE SYS CO LTD0 citations50
US10406642B2Sep 10, 2019
Dual drive pressing apparatus for plural pressing heads
TECO IMAGE SYS CO LTD0 citations40