Inventor
HSU MIN-SHIANG
TW6 patents
Patents
6 patentsUS10204826B1Feb 12, 2019
Method for removing damaged layer embedded in a dielectric layer
UNITED MICROELECTRONICS CORP20 citations91
US10600732B1Mar 24, 2020
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP3 citations72
US12154852B2Nov 26, 2024
Interconnection structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP2 citations71
US11127675B2Sep 21, 2021
Interconnection structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP5 citations71
US12506067B2Dec 23, 2025
Interconnection structure
UNITED MICROELECTRONICS CORP0 citations61
US11646264B2May 9, 2023
Semiconductor structure with super via and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations61